P379 + 451 – UHV sputter deposition cluster tool MPI CPFS
Application
UHV sputter deposition cluster tool for thin film and multilayer deposition at 2″ substrates
Year of delivery
2016
Installation site
MPI CPFS, Dresden, Germany
Design Features
- UHV multichamber magnetron sputter deposition system with combination of confocal and face to face sputtering.
- The standard sample size and shape is 2″ wafer. Special shaped Omicron STM samples possible too.
- UHV deposition chamber system (called SP2) with eight tilt able 2″ magnetrons, thickness sensor head and seperate load lock chamber installed.
- Deposition uniformity better than 5% for all depostition sources.
- All confocal 2″ magnetrons with manual in situ tilting.
- Fully motorized 2 axes sample manipulator with integrated sample shutter, DC bias potential option and maximal sample temperature above 900°C.
- Motorized thickness sensor head.
- Residual gas analyser system.
- UHV deposition chamber (called SP3) with nine 2″ magnetrons and four 3″ magnetrons installed.
- Deposition uniformity better than 5% for all depostition sources.
- Except of two 2″ magnetrons all sources can be used in face to face as well as confocal configuration.
- All confocal 2″ magnetrons with manual in situ tilting.
- Three 3″ magnetron with manual linear translation.
- One 3″ magnetron whithout tilting or translation option installed.
- Fully motorized 3 axes sample manipulator with integrated thickness sensor and maximal sample temperature above 850°C.
- Storage chamber for 16 samples as part of the linear transfer system.
- Load lock chamber with storage for 6 samples, installed lamp heating option and connection port to a glove box.
- Semiautomatic sample transfer between all chambers via a linear distribution chamber system.
- Two MBE and one STM chamber systems provided by Omicron are connected to the linear transfer chamber system.
- Integrated bake out system.
Special Features
- Optional cryo water trap possible at both sputter chambers.
- Handling incl. in situ exchange of sample masks in SP3 sputter chamber.
- Different sample sizes and shapes from 2″ wafer down to 10mm x 10mm samples can be handled (using different kind of sample holders).
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber SP2
Size
About 700 mm diameter, about 700 mm height
Material
stainless steel
Sputtering chamber SP3
Size
About 1050 mm diameter, about 930 mm height
Material
stainless steel
Load lock chamber
(at SP2 chamber)
Size
150 mm diameter, about 215 mm length
Material
stainless steel
Load lock chamber
(at linear transfer chamber)
Size
200 mm diameter, about 320 mm length
Material
stainless steel
Linear transfer chamber
Size
4 segments with 200 mm diameter, about 2260 mm length each
Material
stainless steel
Vacuum
Sputtering chamber SP2
Base pressure
< 6 * 10-9 mbar
Pump down time
3 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Sputtering chamber SP3
Base pressure
< 2 * 10-10 mbar
Pump down time
2 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage in combination with titanium sublimation pumping stage, chamber lid as well as sample manipulator differentially pumped by dry foreline pump
Bake out
< 150°C
Load lock chamber
(at SP2 chamber)
Base pressure
< 10-7 mbar
Pump down time
< 1/2 hour to < 10-6 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Load lock chamber
(at linear transfer chamber)
Base pressure
< 1 * 10-7 mbar
Pump down time
1/2 hour to < 10-6 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Linear transfer chamber
Base pressure
< 2 * 10-10 mbar
Pump down time
< 3 hours to < 10-7 mbar
Chamber pumping
Ion getter pumping stage in combination with titanium sublimation pumping stage
Bake out
< 150°C
Manipulator features
Sputtering chamber SP2
Sample size
diameter max. 2″ substrate
Motion axes
2 motorized axes (z translation and (continous) sample stage rotation)
Temperatures
Room temperature (not stabilized) up to 1000°C at sample
Special features
DC bias potential option
Sputtering chamber SP3
Sample size
diameter max. 2″ substrate
Motion axes
3 motorized axes (manipulator arm rotation, z translation and (continous) sample stage rotation)
Temperatures
Room temperature (not stabilized) up to 900°C at sample
Special features
Handling of sample masks
UHV thickness sensor head
Load lock chamber
Sample size
diameter max. 2″ substrate (max. 6 pieces)
Motion axes
2 manual axes (rotation, z translation)
Rotation axis equipped with an air side indexer plate for easy and fast sample loading via access door or transfer rod
Temperatures
Room temperature (not stabilized) up to 300°C at sample (not stabilized)
Performance test results
Chamber pump down (part 1)
Chamber pump down (part 2)
Long time sample heating (SP2)
Long time sample heating (SP3)
