P372 – 2″ HV sputter deposition JMI
Application
HV sputter deposition system for thin film and multilayer deposition at 2″ substrates
Year of delivery
2015
Installation site
JMI, New Dehli, India
Design Features
- HV magnetron sputter deposition system with combination of confocal and face to face sputter up configurations.
- Up to six 2″ magnetrons in confocal configuration and max. one 2″ magnetron in face to face configuration.
- All magnetrons with manual in situ tilting.
- All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
- Sample manipulator with motorized sample roation, integrated pneumatic shutter, RF sputter cleaning and maximal sample temperature above 800°C.
- Integrated bake out system.
Special Features
- System is prepared for adding a load lock chamber.
- System is prepared to be added to a cluster tool via second transfer port at sputtering chamber.
- Different sample sizes from 2″ wafer down to 10mm x 10mm samples can be handled (using different kind of sample adapters).
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
450 mm diameter, about 750 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 4 *10-8 mbar
Pump down time
3 hours to < 3 * 10-7 mbar
Chamber pumping
Turbo pumping stage, door differentially pumped by dry foreline pump
Bake out
< 150°C
Manipulator features
Sputtering chamber
Sample size
diameter max. 2″ substrate
Motion axes
motorized (continous) sample stage rotation
Pneumatic shutter (part of the manipulator head)
Temperatures
Room temperature (stabilized) up to 800°C at sample
Special features
RF bias / plasma cleaning possible
Performance test results
Chamber pump down
Long time sample heating
Deposition uniformity (confocal sputtering)
RGA spectrum at base pressure
